About
Who are we?
We are a team of Engineers and Scientists looking to disrupt the electronics industry.
Our technology was developed in Buffalo, NY at the University at Buffalo and is manufactured here by a team of University Alumni, Students and Faculty.
Publications
1. Copper Nanoplates for Printing Flexible High-Temperature Conductors: https://pubs.acs.org/doi/abs/10.1021/acsanm.2c00019
2. Flexible Copper Nanowire Electronics for Wireless Dynamic Pressure Sensing: https://pubs.acs.org/doi/abs/10.1021/acsaelm.1c00905
3. Ultrahigh Temperature Copper-Ceramic Flexible Hybrid Electronics: https://pubs.acs.org/doi/abs/10.1021/acs.nanolett.1c02942
4. Printed copper-nanoplate conductor for electro-magnetic interference: https://iopscience.iop.org/article/10.1088/1361-6528/ac40bc
5. Sprayable copper and copper–zinc nanowires inks for antiviral surface coating: https://pubs.rsc.org/en/Content/ArticleLanding/2022/RA/D1RA08755J