Copprium Inc.: Pioneering the Future of Printed Electronics with Copper-Based Inks
In the dynamic world of printed electronics, University at Buffalo (UB) spin-off company, Copprium Inc., is making significant strides with its innovative copper-based conductive inks. Founded as a Venture Studio effort, this cutting-edge startup is poised to disrupt the nearly $4 billion annual conductive ink market, challenging the dominance of silver inks with a more cost-effective and high-performance alternative[1][4].
Copprium's breakthrough technology addresses critical industry needs which allow it to be a direct replacement for silver, currently the solution for most applications. These "hard-tech" products overcome the obstacles holding copper inks back, including:
1. Low-temperature sintering: The inks solidify at low temperatures, expanding their potential applications[1].
2. Corrosion and oxidation resistance: This solves a common challenge faced by other copper conductive inks[1].
3. Cost-effectiveness: Copper is significantly less expensive than silver, making these inks more accessible for various industrial and consumer applications[1][4].
The company's success is a testament to the power of university-industry partnerships. Copprium has leveraged SUNY UB and SUNY RF for crucial resources throughout its journey, including:
- Licensing technology developed by a UB faculty researcher[1]
- Receiving support from the Center of Excellence in Materials Informatics and UB's Department of Chemistry[1]
-Mentoring support from UB as well as SUNY Research Foundation
- Securing a FuzeHub Manufacturing Grant for scaling up production[1]
- Utilizing UB's Business and Entrepreneur Partnerships for access to advanced manufacturing experts, startup resources, and high-tech facilities[1][2]
Operating out of the UB Incubator @ Baird in Amherst with a lab and office, Copprium has been shipping out samples and receiving feedback over the past several months. The company is now poised to begin shipping its products for revenue and raising capital through investors[4].
Copprium's product line includes:
- CuNano: A pure copper ink that sinters at high temperatures
- Hybrink: A copper-silver hybrid that can serve as a plug-and-play replacement for pure silver inks
- ZeroParticle: A molecular-sized technology with potential applications in Internet of Things devices[4]
As the printed electronics industry continues to evolve, Copprium's innovative copper-based inks are set to play a significant role in making this technology more accessible and affordable. By offering a viable alternative to silver inks, Copprium is not just creating a product – they're paving the way for the next generation of flexible, printable electronics.
Citations:
[1] https://www.buffalo.edu/partnerships/collaborate/case-studies/copprium.html
[2] https://www.buffalo.edu/news/releases/2023/03/copprium-moves-its-copper-ink-tech-close-to-marketplace.html
[3] https://pubs.rsc.org/en/content/articlelanding/2022/nr/d2nr03990g
[4] https://www.buffalo.edu/ubnow/stories/2024/04/copprium.html
[5] https://www.cbinsights.com/company/copprium
[6] https://pmc.ncbi.nlm.nih.gov/articles/PMC7559014/
[7] https://pubs.acs.org/doi/10.1021/acsmeasuresciau.1c00059
[8] https://encyclopedia.pub/entry/1916
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