Copprium addresses looming industry cost and supply chain challenges from reliance on silver-based inks.
Boston, MA, 06/13/2024 — Copprium, Inc. is participating at this year’s TechBlick Global Conference and Expo June 11 to 13 at UMass Boston with a presentation and exposition booth. Copprium manufactures conductive inks for commercial and industrial printed electronics applications. Copprium, a startup from University at Buffalo’s Business and Entrepreneur Partnerships team, is bringing the power of Nanomaterials to the world of additive manufacturing by offering copper-based inks as direct replacement for silver-based inks.
At the core of Copprium’s award-winning innovation is a collection of patented nano-technology ink formulations at enable conductive circuits to be applied using 3D printing techniques. Conductive inks are created with electrically conductive materials specifically formulated to allow electrical current to flow through them. Copprium’s inks are plug & play replacements to swap out high-cost silver with copper in traditional electronic applications, particularly when flexibility is needed.
Copprium’s presentation addressed the looming challenge from the reliance on silver in current conductive ink formulations. Silver’s conductivity and corrosion resistance make it a technically useful base material. But the ever-increasing amounts needed for our electronic driven world, coupled with supply chain issues is leading to a doubling of the cost of silver, a business problem that is already happening.
“Our Conductive Inks are opening the door to a wide range of new uses and products,” said Brian Biscoff, founder and CEO, “from wearable medical sensors to hypersonic aircraft, Copprium copper-based conductive inks provide our customers with competitive and cost-effective advantages such as reduced oxidation and corrosion as well as improved performance.”
“TechBlick provides a community platform for the global conductive ink market .” said Edward Tierney, board advisor at Copprium. “It gives members, regardless of size, the opportunity to talk about technical, commercial, and industry related opportunities and obstacles. We believe the industry should be concerned about the reliance on silver-based inks and l we have a direct replacement in our copper-based nanoparticle inks. TechBlick gave us the opportunity to share this with our colleagues and customers.”
To learn more about TechBlick programs and expositions:
About Copprium
Copprium, Inc., a spin-out from the University at Buffalo’s Business and Entrepreneur Partnerships office, is innovating new methods of applying electronic circuitry that are solderable, anti-corrosive, antioxidative, and can be sintered at room temperature or even lower. Using Copprium conductive inks, manufacturers can print electronic pathways on a wide range of materials and flexible surfaces where traditional subtractive processes fall short.
For more information, visit: Copprium Website
About the University at Buffalo Business and Entrepreneur Partnerships
The University at Buffalo’s Business and Entrepreneur Partnerships (BEP) team is in the business of building stronger businesses. We help companies save money, accelerate R&D, solve complex challenges, bring new products and services to market, create jobs, and build talented teams — all to expand the innovation economy in Western New York and beyond.
For more information, visit: University at Buffalo BEP Website
Key words: #ConductiveInk #Nanoinks #copperink
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